Samsung has announced the start of shipments of the industry's first 12-layer HBM4E memory samples to major global customers. This new generation of memory marks the next step in the company's HBM line and is a logical progression of the HBM4 technology that Samsung began mass-producing earlier this year. According to Ixbt.com reports.
According to Samsung representatives, HBM4E memory is designed to significantly accelerate the performance of artificial intelligence (AI) systems and large language models (LLM). This technology provides a stable data transfer speed of 14 Gbps, with the potential to increase this figure to 16 Gbps. The bandwidth per stack reaches 3.6 TB/s.
The current 12-layer version offers 48 GB of capacity, which is more than 30 percent higher than the previous generation. In the future, the company plans to expand this line with 32 GB and 64 GB configurations, opening up new possibilities for high-performance computing systems.
The manufacturer notes that energy efficiency has been increased by 16 percent due to architecture and packaging optimization. Heat dissipation properties have also been improved by more than 14 percent compared to the previous generation. Samsung intends to begin mass production of HBM4E memory according to customer schedules once the pilot delivery phase is complete.
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