New foldable smartphone with Dimensity 9500 chip tested

Renowned insider Digital Chat Station reported testing an engineering sample of a new foldable smartphone. The device is powered by MediaTek's flagship 8-core Dimensity 9500 platform. This chipset offers high performance and is designed for premium smartphones and tablets. According to a report by Ixbt.com.
Regarding the smartphone's design, it will feature rounded corners and a flat front panel. A large circular camera module is located on the back, while the fingerprint scanner is mounted on the side of the device.
The camera capabilities are impressive: the main sensor is 200 megapixels, the ultra-wide-angle module is 50 megapixels, and the periscopic telephoto camera with 3x optical zoom is also equipped with a 50-megapixel sensor. Experts consider this device a balanced and versatile solution.
Digital Chat Station previously revealed accurate information about the Xiaomi 15, Xiaomi 15 Pro, and Realme GT 7 Pro smartphones. The insider also correctly predicted that the Dimensity 9400 chip would hit the market before the Snapdragon 8 Elite processor.
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