Cooler Master and G.Skill have unveiled MasterDIMM AC, a new line of DDR5 modules featuring an active cooling system developed in collaboration. Unlike standard RAM sticks, this innovation is equipped with a massive heatsink with an internal fan to dissipate heat more effectively under heavy loads. This is reported by Ixbt.com reports .
These modules are designed for next-generation platforms and support AMD EXPO and Intel XMP 3.0 technologies. According to technical specifications, speeds of up to 6000 MT/s with CL26 timings for AMD platforms and up to 8400 MT/s for Intel systems have been announced.
According to the company, the active cooling system can reduce memory temperatures by up to 15 °C, while noise levels do not exceed 35 dB. These metrics are crucial for overclocking enthusiasts and users striving for high performance.
The new product is scheduled to be showcased to the public at Computex 2026. So far, Cooler Master and G.Skill have not disclosed information regarding the device's pricing or release dates.
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